Flexible Electronics News

TI to Drive Innovation for IoT, Industrial and Automotive Applications at embedded world 2015

Attendees can get a personal NFC bio-patch that can measure skin humidity and temperature

At embedded world in Nuremberg, Germany, Texas Instruments (TI) will demonstrate how its embedded processing and analog technologies are driving innovation in embedded system designs. Visitors to Hall 5, booth 208 on Feb. 24-26 can experience how TI technology is providing new capabilities for the Internet of Things (IoT), new experiences in industrial and home automation, and innovation in automotive and ultra-low power applications.
 
Additionally, attendees can talk with TI design experts and explore its LaunchPad evaluation kits, BeagleBoards and SensorTag ecosystems in the hands-on workbench area, evaluate several TI Designs reference designs and get a personal near field communications (NFC) bio-patch that can measure skin humidity and temperature.

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